Level I & II Course

• GSM, CDMA, 3G, 4G Network Concept and structure
• ESN, MEID and IMEI SIM relationship, theory and concept
• Physical damage repair and troubleshooting techniques on GSM and CDMA phones
• Determination of physical and liquid damage detection on PCB boards
• Beginning soldering and desoldering techniques
• Use of proper tools and opening techniques to dismantle all make and model of cell phones
• Disassembly and Assembly practice of various styles of mobile devices and identify major components
• Replace LCD, Ribbon flex cable, broken lens, Camera & touch screen glass digitizer
• Phone malfunction and liquid damage troubleshooting
• Power, Volume and Home Button Dome repair
• Change keypad input membrane & copper contact corrosion repair
• Data transfer & recovery
• Cell Phone Unlocking – how to take carrier locks off GSM Phones

Level III Course

• Circuit board block diagram layout architecture – For Component Level Repairs
• RF Shielding removal using proper heating element
• Replace on-board connectors: LCD and Digitizer Molex Plugin connectors
• Replace on-board components: Volume/ Power Switches, Battery connector, SD memory connector, Vibrator, Flex Cable Switch, Multi pin Data Port, and Charging Port
• Identify and repair missing on-board capacitors, circuit bridging techniques